Advanced Epoxy Solution for Electronics & More
ZDS-168AB-Z is a high-performance, fast-curing epoxy resin system designed for demanding industrial and commercial applications. Its outstanding physical and electrical properties make it especially suitable for electronics, automotive, solar energy, aerospace, and construction projects that require superior insulation, waterproofing, and flame retardancy. Engineered for versatility, ZDS-168AB-Z offers a robust balance of adhesion, chemical resistance, and mechanical strength. The epoxy cures quickly at room temperature, forming a hard, durable finish in black or dark red. Its user-friendly mixing ratio allows for precise application, whether you are bonding, potting, or insulating various substrates such as plastics, metals, ceramics, PCBs, and composites.
Key Features
- Excellent insulation performance ensures safety for sensitive electronics.
- Waterproof and flame retardant to meet stringent regulatory requirements.
- Fast cure time (30-60 minutes at 25°C) supports efficient production.
- Superior adhesion for reliable bonding on plastics, metals, ceramics, and more.
- Compatible with various mixing ratios for application flexibility.
Typical Uses
- Potting and encapsulation of electronic components
- Bonding structural and functional parts
- Waterproofing electrical assemblies
- Insulation for PCB and composite assemblies
Whether you are seeking a reliable solution for harsh environments or high-precision assembly, ZDS-168AB-Z epoxy provides exceptional performance across diverse applications.