ZDS-368AB-D Black Silicone Potting Compound with High Thermal Conductivity

Mix RatioMultiple options
Working Time (Pot Life)60 min @25°C
Viscosity8000-10000 cps
Hardness85 Shore A
ColorBlack/Grey
Thermal ConductivityHigh
Electrical InsulationStable

High Performance Silicone Potting for Demanding Applications

ZDS-368AB-D is an advanced two-component silicone potting compound formulated for professionals requiring robust thermal management and environmental protection. Engineered for high thermal conductivity and exceptional high-temperature resistance, it ensures that sensitive electronic and power components remain safe and operational even in challenging conditions. With fast curing at room temperature, multiple mix ratio capabilities, and a stable black or grey finish, this potting solution offers both versatility and reliability.

Key Features

  • High thermal conductivity for effective heat dissipation
  • Outstanding resistance to high temperatures, preventing breakdown in demanding environments
  • Rapid curing time, allowing for efficient production schedules and lower downtime
  • Superior mechanical protection, which guards components against shock, vibration, and moisture ingress
  • Electrically insulating, maintaining safety and circuit integrity
  • Compatibility with a wide range of substrates including plastic, metal, glass, rubber, PCB, composite, and carbon fiber
  • Available in black or grey coloration to match application aesthetics or labeling needs

Common Applications

  • Electronics and PCB encapsulation
  • Automotive assemblies and EV battery protection
  • Solar energy equipment
  • Batteries and energy storage devices
  • Aerospace electronics
  • Construction electronics and smart systems

Why Choose ZDS-368AB-D?

With industry-leading material flexibility and protection, this silicone system is a top choice when thermal efficiency, reliability, and robust insulation are required.

💡 Use Cases
High thermal conductivity,Excellent high temperature resistance,Fast curing,Black/grey color options,Multiple mix ratios,Superior mechanical protection,Stable electrical insulation
Prepare the substrate by cleaning and drying all surfaces to be potted. Mix Part A and Part B thoroughly according to the chosen mix ratio. Degas under vacuum if a bubble-free finish is needed. Pour evenly over the components to be encapsulated, ensuring full coverage. Allow the potting compound to cure at room temperature for at least 60 minutes at 25°C. For accelerated curing, heat may be applied as per the technical datasheet. Avoid disturbing the assembly during curing for best results.
  • Encapsulation of PCBs and electronics
  • Automotive battery and power modules
  • Solar PV inverters and junction boxes
  • BMS and advanced battery packs
  • Aerospace control units
  • General industrial electronics
Available in standard industrial packaging. Store in a cool, dry place away from direct sunlight. Shelf life is typically 12 months from date of manufacture in unopened containers.

What substrates does ZDS-368AB-D bond to?

This potting compound is compatible with plastic, metal, glass, rubber, PCB, composite, and carbon fiber surfaces.

Can I accelerate the curing process?

Yes, heat can be applied to shorten curing time as recommended in the technical datasheet, although room temperature curing is typically sufficient.

Is ZDS-368AB-D suitable for high-power applications?

Absolutely; its high thermal conductivity and robust insulation make it ideal for high-power electronic and automotive solutions.

Get the Ultimate Protection for Your Electronics

Contact us today to request a datasheet or discuss your project requirements.
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