ZDS-369AB-HD High Thermal Conductivity Epoxy Adhesive

Mix Ratio (A:B)Weight 1:1
Working Time30 minutes @ 25°C
Curing Schedule8H @ Room Temp or 2H @ 90°C + 2H @ 120°C + 2H @ 150°C
Viscosity6000-8000 cps
Hardness85 Shore D
Thermal Conductivity1.2 W/m·K (typical)
Volume Resistivity1×10¹⁵ Ω·cm (typical)

High-Performance Epoxy Adhesive for Extreme Conditions

ZDS-369AB-HD is a premium two-component epoxy adhesive formulated to provide exceptional thermal conductivity, electrical insulation, and long-term durability under extreme environmental stresses. With its convenient 6000-8000 cps viscosity and black/grey appearance, this adhesive is specially engineered for advanced industrial applications demanding superior bonding and thermal management.

Features & Applications

  • Wide compatibility: Effectively bonds plastics, metals, ceramics, PCBs, and composite materials, making it ideal for cross-industry integration.
  • Exceptional temperature endurance: Maintains integrity and performance under continuous high-temperature environments, making it suitable for automotive, electronics, battery, solar energy, aerospace, and construction industries.
  • Outstanding reliability: Resists environmental stress and provides durable adhesion even when exposed to challenging conditions.
  • Advanced insulation: Ensures electrical safety and excellent insulation for delicate assemblies.
  • Multi-functional: Can be used for bonding, sealing, potting, thermal conduction, and insulation, meeting various engineering needs.

Main Advantages

  • High temperature resistance for reliable performance under heat.
  • Superior thermal conductivity enables efficient heat dissipation in electronic assemblies.
  • Outstanding electrical insulation safeguards sensitive components.
  • Environmentally stress resistant to ensure service life and structural security.

💡 Use Cases
High temperature resistance, Superior thermal conductivity, Reliable electrical insulation, Easy to use 1:1 mix ratio, Strong adhesion, Environmentally stress resistant, Versatile applications
Ensure bonding surfaces are clean and dry. Accurately measure components A and B in a 1:1 weight ratio. Mix thoroughly until color is uniform. Apply to the prepared surfaces by dispensing or spatula. Clamp or hold parts in position until set. Follow curing schedule for optimal performance. Excess adhesive can be removed before full cure with a suitable solvent. Cure at elevated temperature for maximum heat resistance.
  • Automotive component assembly
  • High-power electronic modules
  • Battery and energy storage systems
  • Solar panel assembly
  • Aerospace assemblies
  • Construction and structural bonding
Supplied in custom dual cartridges or bulk packs. Store below 25°C, away from moisture and sunlight. Shelf life: 12 months in original unopened packaging.

What materials can ZDS-369AB-HD bond?

ZDS-369AB-HD is designed for reliable bonding of plastics, metals, ceramics, PCBs, and composite materials.

Can this epoxy withstand high temperatures over time?

Yes, ZDS-369AB-HD is formulated for high temperature resistance and can maintain performance under prolonged heat exposure.

Is the product suitable for electrical insulation applications?

Absolutely, it offers excellent electrical insulation properties, ideal for electronics and electrical assemblies.

What is the recommended mixing ratio?

The recommended mix ratio is 1:1 by weight for components A and B.

How should I store unused adhesive?

Keep unused ZDS-369AB-HD sealed in its original container, stored below 25°C, away from moisture and sunlight.

Order ZDS-369AB-HD for Extreme Performance

Contact us today to discuss your challenging bonding and thermal management requirements. Our experts are ready to help you choose the optimal epoxy solution.
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