High Performance ZDS-181AB Epoxy Adhesive
ZDS-181AB-P Epoxy Adhesive stands out as a versatile room-temperature curing resin system designed to deliver strong bonds and seamless potting solutions for a wide range of industrial, commercial, and DIY demands. Its two-component formula features a transparent part A and a light yellow part B. When combined, the resulting product rapidly sets at ambient temperature, achieving a strong, chemical-resistant cure ideal for applications on various substrates like plastics, metals, glass, ceramics, wood, PCB, composites, and carbon fiber.
- Mix Ratio: Easy-to-use two-part system ensures consistent results with minimal effort.
- Viscosity: With part A at 3000-4000cps and part B at 800-1500cps, the resin offers excellent flow for thorough substrate penetration and filling.
- Hardness: Reaches a robust 78 Shore D after curing, providing lasting durability.
- Handling: Formulated for effortless mixing and handling, reducing worksite errors and boosting productivity.
Engineered for outstanding performance, ZDS-181AB-P is renowned for its excellent adhesion properties and high chemical resistance, making it suitable for demanding industrial settings, such as automotive and aerospace, as well as sensitive electronic potting and everyday DIY repairs. Its wide range of compatible substrates, from wood to composites and carbon fiber, allows for unmatched flexibility in both professional and hobby environments. The extended work time of 4-6 hours at 25°C enables careful alignment and application, while its complete cure in 24 hours ensures projects progress without delay.
Key Features
- Room Temperature Curing
- High Hardness and Chemical Resistance
- Strong Adhesion on Multiple Substrates
- Easy-to-Mix, Two-Component System
- Ideal for Bonding, Potting & Sealing
Choose ZDS-181AB-P for reliable, straightforward resin applications that don’t compromise on performance or flexibility.