ZDS-100-12 Epoxy Potting Compound for Electronics

Parameter	Value
Type	Epoxy
Model	ZDS-100-12
Appearance	Black, White
Viscosity	5000-10000 cps
Curing Time	1.5-2H @110-115°C
Hardness	75 Shore D
Substrate Compatibility	Plastic, Metal, Ceramic, PCB, Composite
Applications	Electronics, Automotive, Construction, Packaging, Battery

High-Performance ZDS-100-12 Epoxy Resin for Potting & Encapsulation

ZDS-100-12 is an advanced epoxy potting compound developed for demanding applications in electronics, automotive, construction, packaging, and battery manufacturing. Tailored for both professionals and industrial users, this single-component resin offers a unique blend of low viscosity and outstanding mechanical properties, ensuring easy casting and effective encapsulation of a wide range of substrates including plastics, metals, ceramics, PCBs, and composites.

Single-component system eases preparation and application, minimizing errors.
Low viscosity (5000-10000 cps) enables flawless flow and penetration into complex geometries.
Versatile color options: choose between black and white for customized aesthetics or functional requirements.
Hardens to a durable 75 Shore D surface, providing robust protection against environmental hazards.
Excellent adhesion on plastics, metals, ceramics, PCB, and composite substrates.
Efficient curing at 110-115°C within 1.5 to 2 hours, reducing production and handling time.
Designed for potting, sealing, bonding, and insulation needs across multiple industries.

Versatile Industrial Applications

Reliable potting and encapsulation for sensitive electronics and PCB assemblies
Strong and protected connections for automotive modules and battery packs
Weather-resistant sealing in construction and packaging applications

When performance matters most, ZDS-100-12 delivers proven protection, insulation, and sealing capabilities, supporting innovative manufacturing and high-value applications.

💡 Use Cases

Low viscosity, Single component, Durable finish, Wide substrate compatibility, Efficient curing

Clean and dry all surfaces thoroughly before application. Dispense ZDS-100-12 directly onto the target area, ensuring complete coverage and penetration around components or cavities. Maintain the recommended curing temperature (110-115°C) for 1.5 to 2 hours until the resin is fully cured. Use appropriate safety equipment throughout the process. For potting deep sections, cure in stages to prevent excessive heat buildup.

Electronic board encapsulation
Automotive module sealing
Battery potting
Cable joint insulation
Industrial device protection

Supplied in airtight containers. Store in a cool, dry area, away from direct sunlight. Shelf life is 12 months when unopened. Close containers tightly after use to prevent contamination.

What substrates does ZDS-100-12 adhere to?

ZDS-100-12 provides excellent adhesion to plastics, metals, ceramics, PCBs, and composite materials.

Can ZDS-100-12 be used for both potting and sealing?

Yes, this product is suitable for potting, bonding, sealing, and insulation applications across different industries.

What is the recommended curing protocol?

For best results, cure at 110-115°C for 1.5 to 2 hours. Avoid exceeding recommended temperatures to prevent degradation.

Is the resin available in multiple colors?

Yes, ZDS-100-12 is available in black and white to suit various usage and appearance requirements.

How should I store unused ZDS-100-12?

Store in tightly closed containers in a cool, dry environment, protected from sunlight, with a shelf life of 12 months unopened.