Epoxy ZDS-169ab Transparent Resin for Electronics & LED

PropertyValue
Mix Ratio
Usable Time4-6 hours @25℃
Curing Schedule4-6 hours @25°C / 85℃ for 2-4h + 115℃ for 4-6h
100℃ for 6-8h
150℃ for 1h
Hardness90-92 Shore D
Viscosity2000-5000 cps
ColorTransparent
Non-Yellowing Time26 days
Thermal ResistanceExcellent

Epoxy ZDS-169ab Transparent Resin – Premium Solution for Demanding Applications

The ZDS-169ab is a high-performance transparent epoxy resin engineered for advanced electronics, LED, automotive, and construction applications. Offering superior thermal resistance and a high glass transition temperature (TG), this resin stands out with its remarkable clarity and long-term non-yellowing capability for up to 26 days. Its versatile curing profile enables flexible processing through different temperature regimens, making it suitable for a wide variety of manufacturing needs. Exceeding expectations in strength and insulation, ZDS-169ab easily bonds to diverse substrates such as plastic, metal, glass, PCB, composite, and carbon fiber. The hardness of 90-92 Shore D ensures reliable mechanical properties, and the excellent potting and bonding features promote device longevity and durability.

Main Features & Performance

  • High TG resin structure, supporting high-temperature resistance for demanding environments
  • Exceptional transparency and clarity with resistance to yellowing for 26 days
  • Versatile curing cycles: standard room temperature or accelerated thermal cure options
  • Outstanding potting, bonding, and insulating properties
  • Strong compatibility with substrates including plastics, metals, glass, composites, carbon fiber, and PCB materials
  • Optimal viscosity range for excellent processability and penetration

Typical Applications

  • Bonding and assembly in electronics (PCB, sensors, chips)
  • LED component encapsulation and potting
  • Automotive parts insulation and sealing
  • Construction and composite repair

Choose ZDS-169ab for your next high-spec project where clarity, thermal stability, and robust bonding are essential. Its advanced formulation supports premium device reliability and outstanding visual aesthetics.

💡 Use Cases
High glass transition (TG),Transparent finish,Non-yellowing for 26 days,Excellent thermal resistance,Multiple curing options,Strong bonding,Superior clarity
Ensure both bonding surfaces are clean and dry. Mix the resin according to specified ratios and stir thoroughly. Apply the mixture evenly on the desired substrate. For potting and encapsulation, pour resin carefully to avoid air entrapment. Cure at ambient temperature or use the recommended thermal schedules (accelerated cure at 85℃/115℃/100℃/150℃) to achieve desired mechanical properties and appearance.
  • Electronics bonding and encapsulation
  • LED potting
  • Automotive insulation and components
  • Construction and composite bonding
Supplied in sealed containers, stored in a cool, dry environment with temperatures below 25°C. Shelf life is typically 12 months from production date if unopened and stored properly.

Is ZDS-169ab suitable for LED encapsulation?

Yes, its superior transparency and non-yellowing properties make it ideal for LED potting and encapsulation applications.

Can this epoxy bond to metals and composites?

ZDS-169ab is formulated to bond strongly to various substrates including metals, plastics, composites, glass, and PCBs.

What is the recommended curing process?

The resin can be cured at room temperature for 4-6 hours, or in accelerated cycles such as 85℃ for 2-4 hours and 115℃ for 4-6 hours. Refer to technical data for all curing options.

How long does the material remain non-yellowing?

The ZDS-169ab resin maintains clarity and resists yellowing for up to 26 days under standard conditions.

Contact Us for Epoxy ZDS-169ab Solutions

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