ZDS-282ab Two-Component High Strength Epoxy

Mix Ratio (A:B)Working TimeFull CureHardnessShear Strength
2:1 (by volume/weight)30-40 min @25°C24 hrs @25°C82-85 Shore DHigh

Superior Epoxy for High-Performance Bonding

The ZDS-282ab Two-Component High Strength Epoxy is engineered for demanding industrial and DIY applications requiring exceptional adhesion, durability, and thermal resistance. Presented as a light yellow, easily mixable system, this epoxy delivers optimal bonding on a range of substrates, including plastics, metals, glass, ceramics, composites, and PCBs. Its viscosity of 10000-15000 cps allows for versatile application, ensuring consistent and robust results in automotive manufacturing, electronics assembly, construction projects, packaging, batteries, and creative DIY tasks.

Key Features

  • High tensile and shear strength ideal for structural and load-bearing bonds
  • Resistant to high temperatures, maintaining integrity under thermal stress
  • Simple 2:1 mixing ratio by volume or weight ensures user-friendly preparation
  • Working time of 30-40 minutes at 25°C for repositioning and adjustments
  • Exceptional electrical insulation properties, suitable for electronics
  • Excellent adhesion to diverse materials such as plastics, metals, glass, ceramics, composites, and PCBs
  • Durable hardness (82-85 Shore D) enhances longevity of bonded joints

Why Choose ZDS-282ab?

  • Ideal for high-strength applications in automotive repair, electronic module assembly, structural construction, DIY household projects, packaging, and battery module encapsulation
  • Provides reliable insulation and sealing in PCB and component manufacturing
  • Stable and long shelf-life when stored properly

💡 Use Cases
High bond strength,Two-component system,High thermal resistance,Easy mixing,Durable hardness,Wide material compatibility
Mix ZDS-282ab Resin (Part A) and Hardener (Part B) at a 2:1 ratio by weight or volume. Stir thoroughly until a uniform mix is achieved. Apply the mixed epoxy to clean, dry bonding surfaces. Assemble and secure parts within the 30-40 minute working time. Allow the bonded assembly to cure at room temperature for 24 hours for optimal strength. Use appropriate personal protective equipment and ensure adequate ventilation during application.
  • Automotive assembly and repair
  • Electronics and PCB insulation
  • Construction and structural bonding
  • DIY projects
  • Packaging solutions
  • Battery module manufacturing
Available in standard kits. Store in cool, dry conditions below 25°C, tightly sealed. Shelf life: 12 months from manufacture when unopened.

What substrates can ZDS-282ab bond?

ZDS-282ab is formulated to bond plastics, metals, glass, ceramics, composites, and PCBs with high strength.

How should I prepare surfaces before application?

Ensure bonding surfaces are clean, dry, and free from grease or dust to maximize epoxy adhesion.

Can I accelerate the curing process with heat?

Yes, mild heat (e.g., up to 60°C) can be used to shorten curing time, but results may vary based on application thickness and substrate.

Request a Free Sample or Technical Support

Contact us today for technical data sheets, safety information, or a sample of ZDS-282ab to test its exceptional bonding performance.
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