High Performance Epoxy Potting Compound for Demanding Applications
ZDS-368AB-HD is a premium two-component epoxy potting compound designed specifically to address the requirements of modern electronics, automotive, battery, aerospace, and solar energy applications. Engineered for remarkable durability and robustness, this system offers significant thermal conductivity along with superior electrical insulation properties. Its expertly balanced viscosity ensures thorough encapsulation of intricate electronic assemblies while its black/grey appearance provides an aesthetic, uniform finish. With a working time of up to 60 minutes at ambient temperature, users can complete precise potting tasks with confidence and ease.
Key Features and Properties
- Exceptional Thermal Conductivity: Efficient heat dissipation protects sensitive components from thermal stress, extending operational life.
- Outstanding High-Temperature Resistance: Maintains mechanical and electrical integrity in demanding environments.
- Electrical Insulation: Formulated to prevent short circuits and enhance device safety.
- Waterproof Barrier: Ideal for outdoor or harsh-environment electronics where moisture ingress is a concern.
- Versatile Substrate Compatibility: Bonds effortlessly with plastics, metals, glass, ceramics, PCBs, and composites.
- Durable Shore D Hardness: Offers lasting protection and mechanical stability with an 85 Shore D rating.
- Medium Viscosity: 8000-10000 cps viscosity promotes effective potting without excessive run-off or air entrapment.
Applications
- Potting and encapsulation of circuit boards
- Automotive electronics thermal management
- Battery modules protection
- Aerospace electronics environmental sealing
- Solar energy device insulation