Highly Efficient Thermal Conductive Epoxy for Demanding Applications
ZDS-369AB-D is a premium, two-component epoxy adhesive distinguished by its exceptional high-temperature resistance and superior thermal conductivity. Specifically engineered for fast curing under elevated temperature conditions, its robust formulation provides excellent bonding strength for a variety of substrates, including plastics, metals, ceramics, PCBs, and composite materials. With a distinctive black/grey appearance, ZDS-369AB-D delivers both performance and product differentiation, making it an ideal choice for electronics, automotive, battery assembly, solar energy, and construction industries, where reliability and thermal management are paramount.
- Thermal Conductivity: Effectively dissipates heat, safeguarding sensitive components in electronics and automotive sectors.
- High Temperature Resistance: Maintains structural integrity and bond strength under continuous high-temperature exposure.
- Rapid Cure Profile: Accelerated curing at staged elevated temperatures facilitates quicker production cycles and efficient workflow.
- Strong Adhesion: Ensures lasting bonding performance even with challenging substrates.
- Versatile Compatibility: Excellent adhesion to plastic, metal, ceramic, PCB, and composite surfaces.
- Insulative Properties: Provides effective electrical insulation for sensitive device manufacturing.
- Appearance: The black/grey color is ideal for aesthetic blending in technical assemblies.
Typical Use Scenarios
- Bonding heat-generating components in power electronics and automotive.
- Potting circuits, sensors, or battery packs to ensure thermal management and mechanical stability.
- Assembly of PCBs and composite parts exposed to elevated operational temperatures.
- Solar energy device fabrication, where consistent thermal conductivity is required.
- General industrial applications demanding fast cure and high reliability.